APPLICATION

Thermal Management

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Maximise alumina loading

Discover how our range of powder and spheres adds benefit to thermal interface materials, epoxy molding compounds and electronic applications.

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Advantages

  • Powdered and spherical forms for optimal alumina loading and thermal conductivity.
  • Low uranium (4 ppb) and thorium (<1 ppb) options available.
  • Low viscosity in water-based systems.
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Our Product range

Our offer to thermal management, thermal interface materials and epoxy molding compound applications is focused around low surface area, pure powders with larger spheres for the best packing density and highest thermal conductivity. 

Our range also included low radioactive content forms for electronic applications, contact us for more information.

Spherical SEA6

SEM image of Spherical S-EA6

 

 

The SupALOX®  range provides low surface area, fine powders to complement spherical alumina products for the best pigment-binder ratio, optimising thermal conductivity.

SupALOX powdered alumina with spherical options for maximal thermal conductivity

PRODUCT PURITY CRYSTAL PHASE PSD (D50)/μm BET Surface Area m2/g FORM
SupALOX AD1 5N ALPHA 0.27 8-14 Powder
SupALOX N2 4N ALPHA 0.45 < 10 Powder
SupALOX N3 4N ALPHA 0.60 <10 Powder
SPHERICAL S-EA6  3N ALPHA 10 1 Spheres

We are an ISO 9001, ISO 45001, and ISO 14001 certified company.

We are committed to excellence and sustainability. Our ISO 9001, ISO 45001, and ISO 14001 certifications reflect our dedication to quality management, occupational health and safety, and environmental responsibility

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